模塊化選擇簡化和未來的M2M，Wi-Fi和ZigBee連接的證明

　　機器對機器（M2M）連接的預(yù)測確定了數(shù)十億美元的醫(yī)療、工業(yè)、家庭、智能電網(wǎng)交換數(shù)據(jù)的設(shè)備，以及尚未定義的市場。由于地理位置優(yōu)越，遺產(chǎn)的改造，和地理，大多數(shù)M2M連接將無線，依靠IP包和IPv6尋址，和發(fā)生在WPAN ZigBee?或無線局域網(wǎng)Wi-Fi?網(wǎng)絡(luò)。隨著創(chuàng)新的M2M應(yīng)用和無線協(xié)議的發(fā)展，模塊化的單芯片和雙芯片集成電路正在跟上“未來的”設(shè)計。本文探討了一些ZigBee和Wi-Fi芯片組的特點和系統(tǒng)分區(qū)。

　　物聯(lián)網(wǎng)

　　“物聯(lián)網(wǎng)”描述了一個未來，各種設(shè)備相互連接，交換有意義的數(shù)據(jù)，越來越?jīng)]有人的干預(yù)。為每個基于微控制器的子系統(tǒng)分配地址將導(dǎo)致比任何人都能計算出更獨特的連接節(jié)點，但在未來幾年中肯定會達(dá)到數(shù)十億。這些所謂的M2M業(yè)務(wù)中有很大一部分是基于IP的，松耦合的發(fā)生，相對接近2.4 GHz和5 GHz無線個域網(wǎng)和WLAN網(wǎng)絡(luò)由ZigBee和Wi-Fi。ZigBee提供了高達(dá)250 kbps的數(shù)據(jù)速率和極低的功率的好處，而Wi-Fi擁有卓越的速度高達(dá)600 Mbps的已經(jīng)或易于安裝的消費設(shè)備，但犧牲成本和功率。

　　Yet the M2M growth phenomenon is characterized by this key fact： rapid change and evolution. No one knows exactly what systems or devices will be interconnected， or what kind of data will be exchanged. New systems and ideas are rapidly emerging， favoring modular approaches to chipset implementations. RF standards like 802.11ac （Wi-Fi） continue to evolve by adding channels， bandwidth， and security， while application-specific protocols such as ZigBee Smart Energy V2.0 are gaining traction in other venues such as powerline， automotive， and Wi-Fi.

　　For the reasons previously mentioned， chipset vendors are offering modular solutions for ZigBee and Wi-Fi M2M connectivity. In some instances， the MCU/MPU is separate from the RF section and connected by a standard UART or SPI interface. This allows swapping out either the processor or the radio or maintaining backwards legacy code compatibility. In other cases， a mixed-signal single-chip SoC is modularized or upgraded with freely available vendor protocol libraries and applications stacks. In this article， we’ll take a look at several IC manufacturers’ offerings and consider them in terms of board footprint， power consumption， RF performance， ZigBee protocols， Wi-Fi protocols， and available development tools.