音頻應(yīng)用中麥克風(fēng)的MEMS技術(shù)

　　新一代的麥克風(fēng)為新功能、高質(zhì)量的音頻和更低的成本打開了機(jī)會(huì)。

　　使用相同的CMOS硅技術(shù)集成電路，微機(jī)械器件（MEMS）比傳統(tǒng)的麥克風(fēng)更小，更可靠，可以表面安裝。這允許麥克風(fēng)被放置在許多不同的地方，開辟新的功能，如噪聲消除，以及允許安裝麥克風(fēng)陣列，用于檢測(cè)和指導(dǎo)音頻流的方向。

　　微機(jī)械加工采用標(biāo)準(zhǔn)CMOS工藝技術(shù)的變化，在硅中構(gòu)建物理結(jié)構(gòu)而不是電子結(jié)構(gòu)。這些可以在加速度計(jì)和陀螺儀麥克風(fēng)或運(yùn)動(dòng)傳感器膜片的設(shè)計(jì)不同，利用老舊的工廠，成本更有效。

　　Using CMOS technology also allows standard interfaces to be implemented on the same silicon， increasing the integration and reducing both the system power consumption， as there are less chip-to-chip connections， and the overall bill of materials. As the reliability has improved， these factors have driven the technology into the consumer market， particularly in mobile phones. The low profile and surface-mount capability that comes from the MEMS approach means the microphones can be mounted easily anywhere in a design and allows the end equipment to be thinner.

　　These devices are used in high volumes in mobile terminals， laptop and notebook computers as well as voice-over-IP terminals， and digital still and video cameras. Also， they are increasingly being used to provide voice control in gaming and virtual-reality input devices and even for industrial systems， as well as noise cancellation and even antitheft systems.